Precision across microelectronics processes
Laser solutions for the microelectronics industry
Expertise across microelectronics laser processes
Luxinar supports microelectronics manufacturers with laser solutions for PCB depaneling, flexible PCB processing, marking, trimming, ceramics, glass and thin films.
Flexible laser technologies
Luxinar offers a wide range of laser technologies from CO2, to nanosecond and femtosecond lasers to find the best solution for your specific material and requirements
A long-term partner for OEMs and integrators
Luxinar combines laser technology with application know-how to support OEMs and system integrators in developing and implementing reliable microelectronics processes.
Your challenges
How Luxinar addresses your challenges
Microelectronics production is under constant pressure to deliver reliable results at competitive cost. That’s how we help you:
- Competitive cost of ownership: Our sealed laser designs reduce maintenance effort and support long-term cost efficiency in price-sensitive markets.
- Built for 24/7 production: Luxinar lasers are designed for continuous industrial operation with consistent output and high uptime.
- Reliable, repeatable processes: Precise pulse control and stable beam performance support consistent product quality across production runs.
- Expert application support: Our application engineers work with you on feasibility studies, product selection and process design for your specific requirements.
Find the best solution for your PCB depaneling, laser cutting, marking and scribing needs in the microelectronics industry.
Solutions for microelectronics
Laser PCB depaneling: our core solution for PCB manufacturing
Laser depaneling separates individual rigid printed circuit boards from a panel with high precision and without mechanical contact. Compared to mechanical routing, sawing or punching, laser depaneling reduces dust, prevents delamination, and protects sensitive components.
Luxinar offers different technologies depending on the priorities of the rigid PCB depaneling process:
- 532 nm Vivio nanosecond lasers for balancing throughput and cut quality
- 355 nm Vivio nanosecond lasers for fine, quality-sensitive processing
- SR series and OEM series CO₂ lasers for high-speed applications with moderate edge-quality requirements
- Aionis femtosecond lasers for applications demanding the highest precision and the lowest thermal impact
Solutions for microelectronics
Additional laser processing solutions for microelectronics
Beyond PCB depaneling, Luxinar laser solutions support a range of additional microelectronics applications:
Flexible PCB cutting and processing
Laser cutting supports the precise processing of flexible PCBs without mechanical contact. The appropriate laser technology depends on the material, required throughput, edge-quality requirements and thermal impact of the process.
PCB marking
CO₂ and 355 nm nanosecond lasers apply alphanumeric text and Data Matrix codes to PCBs and electronic components with high precision and contrast. Applications include PCB marking, component labelling and traceability codes.
Laser trimming for precision resistors
Pulsecore® nanosecond lasers selectively remove material to achieve exact electrical values. This contact-free process at highest process speed enables fine adjustment with excellent repeatability for hybrid circuits, sensors and precision electronics.
Laser cutting of technical ceramics
Industrial CO₂ lasers and Pulsecore® femtosecond lasers provide a robust solution for cutting technical ceramics used in microelectronics. Suitable materials include alumina, zirconia, aluminium nitride and boron nitride.
Precision glass cutting
CO₂ lasers enable contact-free cutting of glass, including the controlled cutting of quartz glass and glass rims. Depending on the process, glass can be cut hot or cold. The non-contact process avoids tool wear and supports the processing of complex glass shapes. Explore quartz glass laser processing.
Precision ceramic scribing
CO₂ laser scribing enables the controlled separation of technical ceramics using a scribe-and-break process. Precise control of the scribing depth supports clean breaks, high repeatability and a reduced risk of breakage. Explore ceramic laser processing.
Laser thin film cutting
Thin films can be kiss-cut on glass substrates or cut as unsupported materials with minimal debris and heat-affected zones. Luxinar offers multiple laser technologies for thin-film processing, including AOM-integrated CO₂ lasers for precise film processing, Vivio 355 nm nanosecond lasers for efficient thin-film cutting, and Aionis femtosecond lasers for the highest precision and edge quality with minimal thermal impact.
Laser backlight unit (BLU) patterning
CO₂ lasers combined with AOM technology create consistent patterns on PMMA for backlight units. Precise pulse control and power stability support uniform light distribution and crisp, consistent dots across the workpiece.
Electronic component marking
Pulsecore® nanosecond lasers offer the fastest and most precise control of laser pulses which enables higher speeds in marking processes while creating consistent and high-contrast serial numbers, codes or logos.