Ceramic processing
Precision laser cutting and drilling of ceramics without mechanical stress
Stress‑free processing
Non‑contact CO₂ laser machining avoids mechanical stress, reducing cracks, chipping, and rejects in hard ceramic materials.
Reliable ceramic separation
Laser cutting ceramics via scribing and drilling enables controlled “scribe and break” separation, delivering clean breaks and higher yields than full cutting.
Precise pulse control
Long pulse widths from microseconds up to 1 ms enable controlled depth and clean edges in laser drilling ceramic applications, with superior results even in brittle ceramics.
Ceramic machining
Reliable laser processing for brittle technical ceramics
Technical ceramics such as alumina (Al₂O₃) are extremely hard and brittle, making conventional machining slow, costly, and risk‑prone. Mechanical tools introduce stress, micro‑cracks, and frequent tool wear—especially in miniature components used in microelectronics.
CO₂ laser processing removes material without tool contact, minimizing stress while enabling fine lines, holes, slots, and complex contours. Luxinar CO₂ lasers are engineered for this challenge.
Precise pulse control from 2 µs to 1 ms, long pulses and slow process speeds deliver cleaner edges, controlled depth, and repeatable results in laser cutting, drilling, and scribing of demanding ceramics.
Why Luxinar
Designed for demanding ceramic applications
Luxinar CO₂ lasers combine stable beam quality with long‑pulse flexibility, giving OEMs and system integrators full control over ceramic processing. Integration-ready, sealed designs reduce integration effort and long‑term operating costs.
Key benefits for laser cutting and drilling ceramics:
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Long pulse capability up to 1 ms
Enables precise depth control for scribing, drilling, and “scribe‑and‑break” processes with cleaner breaks. -
Minimal mechanical stress
Non‑contact processing reduces chipping and micro‑cracks in brittle alumina components. -
Superior beam quality (M² < 1.2)
Supports fine features and repeatable results, even on small, high‑density components. -
Durable, sealed CO₂ design (IP66)
Ensures reliable operation in harsh industrial environments. -
Lower total cost of ownership
No tool wear, minimal maintenance, and long service life reduce operating costs over time.
Materials & areas of application
Where laser processing of ceramics is used
Microelectronics and semiconductor packaging
Laser cutting, drilling, and scribing of ceramic substrates for precise separation and electrical insulation.
Power electronics substrates
Laser machining of alumina and ceramic boards to create slots, holes, and outlines for high‑voltage components.
Automotive electronics
Precision laser processing of ceramics used in control units, sensors, and power modules.
Industrial sensors and RF components
Laser drilling and profiling of ceramic materials for accurate geometries and stable signal performance.
Advanced ceramics manufacturing
Laser cutting, scribing, and controlled separation of technical ceramics without mechanical stress.
Achieve cleaner ceramic cuts with precise, pulsed CO₂ lasers.
Suitable laser models
Recommended Luxinar lasers for processing ceramics
SR 25i
SR 15i
SR 10i
Destiny series*
*Ceramicore® Destiny is a CW laser that supports processing of ceramics, offering a compact and cost‑effective option, but without IP66 protection or integrated beam conditioning.